| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition imparting excellent solder heat resistance and flame retardance to a cured product, to provide the cured product thereof, to provide a multifunctional hydroxy compound and to provide an epoxy resin. SOLUTION: A bifunctional hydroxy compound has a molecular structure represented by structural formula (1) (wherein, R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>represent each a 1-4C alkyl group; and R<SP>5</SP>, R<SP>6</SP>, R<SP>7</SP>and R<SP>8</SP>represent each independently a hydrogen atom or a 1-4C alkyl group). An epoxidized material thereof is used as a principal agent or a curing agent. COPYRIGHT: (C)2008,JPO&INPIT
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