| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure using a high-heat-conduction member for efficiently dissipating the heat generated by a display panel of a plasma display device. SOLUTION: A high-heat-conduction member having superior plane heat conductivity is attached to a holding plate, having a first plane portion opposed to the display panel and a second plane portion raised from the first lane portion integrally to the opposite side from the display panel, in the same continuous plane constituting the first plane portion and second plane portion of the holding plate, the first plane portion of the holding plate being a heat receiving portion thermally connected to a glass substrate of the display panel to serve as a heat dissipation plane portion protruded into air at the second plane portion. COPYRIGHT: (C)2008,JPO&INPIT
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