ADHESIVE COMPOSITION, CIRCUIT CONNECTING STRUCTURE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition capable of achieving the excellent adhesive strength even under low temperature and short-time curing conditions. SOLUTION: The adhesive composition comprises (a) a thermoplasic resin having a urethane bond and an ester bond in the same molecule and containing 15-25 mol% of a structural unit derived from a diisocyanate compound, (b) a radical polymerizable compound and (c) a radical polymerization initiator. COPYRIGHT: (C)2008,JPO&INPIT