METAL THIN FILM WITH PLASTIC, PRINTED-CIRCUIT BOARD, ITS MANUFACTURING METHOD, MULTILAYER WIRING BOARD, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a metal thin film with plastic in which a fine wiring pattern can be sufficiently excellently formed and which does not need to use a polyimide film when forming a metal layer. SOLUTION: The metal thin film with plastic 100 has a support body 1, a first metal layer 2 formed on the support body 1 by a vapor deposition method, a second metal layer 3 formed on the first metal layer 2, and a resin layer 4 comprising an insulating resin composition formed on the second metal layer. COPYRIGHT: (C)2008,JPO&INPIT