| 摘要 |
A semiconductor manufacturing apparatus is provided to reduce structural complexity by arranging effectively components thereof in an arrangement process. A semiconductor manufacturing apparatus includes a process module(10) and a transfer module. The process module includes an open top part. The process module further includes a lower chamber(100), a supporting plate, and an upper chamber(34). The lower chamber is used for processing a substrate. The supporting plate is installed within the lower chamber. A substrate is loaded on the supporting plate. The upper chamber is used for opening/closing a top part of the lower chamber. One end of the upper chamber is extended and connected directly to a transfer module(30).
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