| 摘要 |
A wiring pattern can be formed with a high density on a substrate as a highly reliable printed circuit board. A method of manufacturing a printed circuit board includes a step of forming a conductive layer, which is to be used as a plating power supplying layer, on a substrate, a step of forming a first mask pattern for forming a predetermined wiring pattern on a surface of the conductive layer, carrying out electroplating with the conductive layer as the plating power supplying layer to form a conductive part on the conductive layer, and then removing the first mask pattern, and a step of forming a second mask pattern that exposes required parts of the conductive part on the substrate, on which the conductive part has been formed on the conductive layer, carrying out electroplating with the conductive layer as the plating power supplying layer to form protective plating on exposed parts of the conductive part, and then removing the second mask pattern. |
