SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor package and a manufacturing method thereof are provided to reduce a total size thereof by stacking a plurality of semiconductor chips in a vertical direction. One surface of a first semiconductor chip(26) including a first connective terminal(27) is attached to one surface of a heat-radiating plate(20) including a through electrode(22) corresponding to the first connective terminal. The first semiconductor chip is encapsulated by coating an insulator(30) on one surface of the heat-radiating plate. A second connective terminal(29) is formed on one surface of a second semiconductor chip(28). The other surface of the second semiconductor chip is attached to the other surface of the heat-radiating plate. The second semiconductor chip is encapsulated by coating the insulator on the other surface of the heat-radiating plate. A first via(36) is formed by punching the insulator coated on the other surface of the heat-radiating plate. The first via is electrically connected to the first and second connective terminals.