发明名称 FOAM PLASTIC HEAT INSULATING COMPOSITE PANEL
摘要 PROBLEM TO BE SOLVED: To provide a foam plastic heat insulating composite panel the warpage of which can be easily suppressed and which enables the easy fractional disassembly and fractional collection. SOLUTION: This foam plastic heat insulating composite panel comprises a foam plastic heat insulating board 11 having one or more fitting grooves 12 formed in an arranged direction, a foam plastic reinforcement member 13 of 450 to 560 kg/m<SP>3</SP>in density installed for each fitting groove 12, fitted and fixed to the fitting groove 12 by using an adhesive agent, and a warpage suppressing tape 14 formed of an aluminum adhesive tape of 50 to 200μm in thickness installed on one side surface of the foam plastic reinforcement member 13 excluding the other side surface fitted to the fitting groove 12 and having a coefficient of expansion smaller than that of the foam plastic reinforcement member 13. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008025099(A) 申请公布日期 2008.02.07
申请号 JP20060195165 申请日期 2006.07.18
申请人 IWAKURA KAGAKU KOGYO KK 发明人 YOSHIDA TOSHIO;HARADA MITSUHIRO;YAMAMOTO SHIGETAKA;ABE YASUYUKI;INADA NORIO;KAMIBAYASHI HIDEFUMI;TATEWAKI SUGURU
分类号 E04B1/80;E04B1/16 主分类号 E04B1/80
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