| 摘要 |
A simple and cost-effective possibility is proposed for producing optically transparent regions ( 5, 6 ) in a silicon substrate ( 1 ), by the use of which both optically transparent regions of any thickness and optically transparent regions over a cavity in a silicon substrate are able to be implemented. For this purpose, first at least a specified region ( 5, 6 ) of the silicon substrate ( 1 ) is etched porous. Thereafter, the specified porous region ( 5, 6 ) of the silicon substrate ( 1 ) is oxidized.
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