发明名称 INTER-COMMUNICATING MULTI MEMORY CHIP AND SYSTEM INCLUDING THE SAME
摘要 A multi-memory chip capable of performing inter-communication and a system including the same are provided to reduce latency by shortening a data transfer time among memories in the multi-memory chip stacking a multi-core CPU and a plurality of memories. A multi-memory chip(21) comprises a multi-core CPU(23) and a plurality of stacked memories respectively controlled by a corresponding CPU core. Data is directly exchanged among the memories. Each memory includes an I/O(Input/Output) sense amplifier and an I/O driver at a central part and/ an upper/lower ends for data transfer. A first memory receives a command for reading/transferring the data to second and third memories, and an address for reading the data from the first memory from a first CPU core corresponding to the first memory when the data is transferred from the first memory to the second and third memories.
申请公布号 KR20080079552(A) 申请公布日期 2008.09.01
申请号 KR20070019917 申请日期 2007.02.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG, UK SONG;LEE, JUNG BAE
分类号 G06F12/00;G06F9/46;G06F15/163 主分类号 G06F12/00
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