发明名称 |
INTER-COMMUNICATING MULTI MEMORY CHIP AND SYSTEM INCLUDING THE SAME |
摘要 |
A multi-memory chip capable of performing inter-communication and a system including the same are provided to reduce latency by shortening a data transfer time among memories in the multi-memory chip stacking a multi-core CPU and a plurality of memories. A multi-memory chip(21) comprises a multi-core CPU(23) and a plurality of stacked memories respectively controlled by a corresponding CPU core. Data is directly exchanged among the memories. Each memory includes an I/O(Input/Output) sense amplifier and an I/O driver at a central part and/ an upper/lower ends for data transfer. A first memory receives a command for reading/transferring the data to second and third memories, and an address for reading the data from the first memory from a first CPU core corresponding to the first memory when the data is transferred from the first memory to the second and third memories.
|
申请公布号 |
KR20080079552(A) |
申请公布日期 |
2008.09.01 |
申请号 |
KR20070019917 |
申请日期 |
2007.02.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG, UK SONG;LEE, JUNG BAE |
分类号 |
G06F12/00;G06F9/46;G06F15/163 |
主分类号 |
G06F12/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|