发明名称 Fremgangsmåde til elektrisk isolering af et underlag til et effektmodul
摘要 Applied up to the edge of a substrate (20), an insulating substance (IS) (70) is not fully cross-linked before fitting the substrate in a casing (60) so designed that, during its interlocked fitting, a recess (62) remains over one part of the casing's width. When placed in this recess and after complete curing/hardening-off, the IS acts an adhesive bond between the casing and the substrate.
申请公布号 DK1594165(T3) 申请公布日期 2008.10.06
申请号 DK20050009075T 申请日期 2005.04.26
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG 发明人 AUGUSTIN, KARLHEINZ;GOEBL, CHRISTIAN
分类号 H01L21/56;H01L21/98;H01L23/053;H01L23/24;H01L23/28;H01L23/31;H01L23/373;H01L25/07;H01L25/18;H05K3/28 主分类号 H01L21/56
代理机构 代理人
主权项
地址