发明名称 |
Fremgangsmåde til elektrisk isolering af et underlag til et effektmodul |
摘要 |
Applied up to the edge of a substrate (20), an insulating substance (IS) (70) is not fully cross-linked before fitting the substrate in a casing (60) so designed that, during its interlocked fitting, a recess (62) remains over one part of the casing's width. When placed in this recess and after complete curing/hardening-off, the IS acts an adhesive bond between the casing and the substrate. |
申请公布号 |
DK1594165(T3) |
申请公布日期 |
2008.10.06 |
申请号 |
DK20050009075T |
申请日期 |
2005.04.26 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG |
发明人 |
AUGUSTIN, KARLHEINZ;GOEBL, CHRISTIAN |
分类号 |
H01L21/56;H01L21/98;H01L23/053;H01L23/24;H01L23/28;H01L23/31;H01L23/373;H01L25/07;H01L25/18;H05K3/28 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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