| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with a plurality of semiconductor chips laminated on a chip carrier capable of decreasing an occurrence of an unfilled sealing resin and thinning itself. SOLUTION: The semiconductor device comprises a wiring board 21 with a via hole 22 having a first wiring electrode 22a on its bottom provided on its surface and with a second wiring electrode 23 formed on its outside, a first semiconductor chip 26 having an electrode 27 electrically connected by the first electrode 22a of the via hole 22 and a first bump 28 on its surface, and a second semiconductor chip 29 larger than the first semiconductor chip 26 and having an electrode 30 on its surface. The electrode 30 of the second semiconductor chip 29 is electrically connected with the second wiring electrode 23 by a second bump 31, the first semiconductor chip 26 is adhered to the wiring board 21, and a single sealing resin 33 is formed between the second semiconductor chip 29 and the wiring board 21. COPYRIGHT: (C)2005,JPO&NCIPI |
