| 摘要 |
A process for the production of a void-free semiconductor wafer for the electronics industry, comprising the steps of: applying a coating of a solder paste to a semiconductor wafer through a photoresist film; heating and applying a vacuum to the wafer in a reflow furnace with a controlled formic acid vapor ambient to for a first reflow to remove the flux and form void free solder bumps on the wafer; processing the wafer to remove the photoresist film; heating the wafer in a reflow furnace with a controlled formic acid vapor ambient for a second reflow to remove surface oxides from the wafer and to form the solder into final void free metal solder bumps.
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