SEMICONDUCTOR PACKAGE OF PACKAGE ON PACKAGE(POP) TYPE HAVING TAPE FOR TAB

摘要

A semiconductor package of a package on package(POP) type having a tape for TAB is provided to connect an upper package with a lower package electrically through solder balls and the tape for TAB without limits of thickness or size of the package. A semiconductor package of a package on package(POP) type having a tape for TAB(118) comprises a lower package(100) and an upper package(200). The lower package includes a lower chip(104) attached on a lower substrate(102). The tape of TAB is bendable and mounted on the lower chip and the lower substrate of the lower package, connects the lower chip with the lower substrate electrically, and had contact holes(116) at a circuit pattern on the lower chip. The upper package is located on the tape for TAB and includes an upper chip(214). The upper package is connected with the lower package electrically through solder balls(120) formed in the contact holes and the tape for TAB.