| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thick-film conductor composition capable of surely forming a backside Ag electrode having high bonding reliability to a backside Al collector electrode, and to provide the backside Ag electrode having high bonding reliability to the backside Al collector electrode formed by using the thick film conductor composition. <P>SOLUTION: As the thick film conductor composition used for forming the backside Ag electrode, while containing Ag powder, Ni powder, glass frit, and vehicle, that which is made to contain Ni powder whose mean particle diameter is 0.1-1.0μm with the ratio of 0.5-2.0 wt.% with respect to the Ag powder is used. Moreover, the thick film conductor composition, containing Ni powder whose mean particle diameter is 0.1-1.0μm with the ratio of 0.5-2.0 wt.% to the Ag powder while containing Ag powder, Ni powder, glass frit, and vehicle, is applied to the surface of the backside Al collector electrode, the backside Ag electrode 6 for performing solder-bonding of an interconnector to the backside Al collector electrode 5 is formed by baking. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
