发明名称 LIGHT RECEIVING PACKAGE FOR OPTICAL SENSOR, AND SAME OPTICAL SENSOR
摘要 PROBLEM TO BE SOLVED: To improve the noise proof of an optical sensor, and facilitate its development into other kinds of devices, and further, reduce the necessary time and cost of the development. SOLUTION: A bare chip 3 whereinto a photo diode, amplifying circuit, and oscillating circuit are integrated, a coupling capacitor 4 connected with the amplifying circuit, and a resistance 5 for oscillating frequencies whereby the oscillating frequency of the oscillating circuit is specified are so mounted on a packaging substrate 2 and they are so sealed by a transparent resin as to constitute out of them a light receiving package 1 for the optical sensor and as to mount it on a secondary mounting substrate 9. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008192874(A) 申请公布日期 2008.08.21
申请号 JP20070026462 申请日期 2007.02.06
申请人 OMRON CORP 发明人 KAMEDA TAKAMICHI;MIYATA TAKESHI;OKUNO MOTOHARU
分类号 H01L31/10 主分类号 H01L31/10
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