| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable wiring board having higher size accuracy without plating a terminal at the side surface. SOLUTION: The wiring board has a substrate including through holes plated with a conductive metal and a conductive metal bonded to this substrate and is conductive to the conductive metal plating of the through holes. Thickness of this conductive metal is set equal to or more than the thickness of substrate. COPYRIGHT: (C)2008,JPO&INPIT
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