发明名称 GAME MACHINE MODULE, ITS COOLING METHOD AND GAME MACHINE USING IT
摘要 PROBLEM TO BE SOLVED: To effectively cool heat generating parts via air inside a case without the use of a cooling fan or the like. SOLUTION: The game machine module is provided with a module main body having the heat generating parts 36 and the case 35 for housing the main body and makes game balls B rolling on a game-ball feeding route 42 of the module absorb heat of the air inside the temperature-risen case 35 of the module. The top board 51 of the case 35 and the route 42 are formed of a high-thermal-conductivity material. The board 51 is brought into contact with the route 42 via a radiating member 60 with high thermal conductivity. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008188299(A) 申请公布日期 2008.08.21
申请号 JP20070027200 申请日期 2007.02.06
申请人 SEIKO EPSON CORP 发明人 TAKAHASHI HIDEYUKI
分类号 A63F7/02 主分类号 A63F7/02
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