发明名称 LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF
摘要 A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.
申请公布号 US2008197370(A1) 申请公布日期 2008.08.21
申请号 US20070737133 申请日期 2007.04.18
申请人 发明人 LIN HUNG-YI;CHANG HONG-DA
分类号 H01L29/12;H01L21/02;H01L33/48;H01L33/60;H01L33/64 主分类号 H01L29/12
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