| 摘要 |
PROBLEM TO BE SOLVED: To solve the following problems: interlayer separation in a multilayer interconnection board is caused by allowing a nail portion of a support means in a solid-state image pickup device provided in electronic equipment to rub against the side of the multilayer interconnection board for composing the solid-state image pickup device when incorporating the solid-state image pickup device into the electronic equipment; and improper operation in the solid-state image pickup device is caused by damaging a continuity via formed in a through hole making interlayer continuity. SOLUTION: On the multilayer interconnection board for composing the solid-state image pickup device, there is a region in which no through holes are disposed around a region in which the nail component of a support member in the solid-state image pickup device comes into contact with the side of the multilayer interconnection board. COPYRIGHT: (C)2008,JPO&INPIT
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