| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure for cooling a semiconductor device, which can absorb heat even if the heat generation rate of the semiconductor device increases rapidly in a short time, while controlling the increase of the volume of a heat sink. <P>SOLUTION: The structure for cooling a semiconductor device includes: a semiconductor device 1; a heat sink 2 on which the semiconductor element 1 is mounted; and a heat storage member 3, which is attached to the semiconductor element 1 on a side opposite to the side on which the heat sink 2 is mounted for the semiconductor element 1; and a case 31 and a latent heat storage material 32. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
