发明名称 |
BONDED STRUCTURE, BONDING METHOD, LIQUID DROPLET DISCHARGE HEAD AND METHOD FOR PRODUCING LIQUID DROPLET DISCHARGE HEAD |
摘要 |
PROBLEM TO BE SOLVED: To obtain a bonded structure that relaxes a stress occurring at a bonded interface and has improved adhesion reliability and durability and to provide a bonding method, a liquid droplet discharge head and a method for producing a liquid droplet discharge head. SOLUTION: The bonded structure comprises a nozzle substrate 11 laminated through an adhesion layer 23 to a flow channel forming substrate 12 in which the adhesion layer 23 has a plurality of adhesion parts 23a dispersed and arranged in the adhesion region of the flow channel forming substrate 12. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008189727(A) |
申请公布日期 |
2008.08.21 |
申请号 |
JP20070023438 |
申请日期 |
2007.02.01 |
申请人 |
SEIKO EPSON CORP |
发明人 |
MATSUO YASUHIDE |
分类号 |
C09J5/00;B32B7/14;B41J2/045;B41J2/055;B41J2/16 |
主分类号 |
C09J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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