发明名称 BONDED STRUCTURE, BONDING METHOD, LIQUID DROPLET DISCHARGE HEAD AND METHOD FOR PRODUCING LIQUID DROPLET DISCHARGE HEAD
摘要 PROBLEM TO BE SOLVED: To obtain a bonded structure that relaxes a stress occurring at a bonded interface and has improved adhesion reliability and durability and to provide a bonding method, a liquid droplet discharge head and a method for producing a liquid droplet discharge head. SOLUTION: The bonded structure comprises a nozzle substrate 11 laminated through an adhesion layer 23 to a flow channel forming substrate 12 in which the adhesion layer 23 has a plurality of adhesion parts 23a dispersed and arranged in the adhesion region of the flow channel forming substrate 12. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008189727(A) 申请公布日期 2008.08.21
申请号 JP20070023438 申请日期 2007.02.01
申请人 SEIKO EPSON CORP 发明人 MATSUO YASUHIDE
分类号 C09J5/00;B32B7/14;B41J2/045;B41J2/055;B41J2/16 主分类号 C09J5/00
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