| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card capable of electrically detecting the cracks of an IC chip and preventing the occurrence of future breakdown of the IC chip. <P>SOLUTION: An IC chip 4 is formed in a circuit forming layer 6, with a resin layer 8 being laminated. In a surface 8a, separated from the circuit forming layer 6 of the resin layer 8, a circuit pattern 10 is formed. When a crack that does not reach the circuit forming layer 6, is produced from the surface 8a side of the resin layer 8, since the possibility is high that this crack will reach the circuit forming layer 6 in the future, the fracture of the circuit pattern 10 due to the crack is detected, and the breakdown of the IC chip 4 is prevented from occurring. <P>COPYRIGHT: (C)2008,JPO&INPIT |
