发明名称 |
LIQUID PHASE ETCHING METHOD AND LIQUID PHASE ETCHING APPARATUS |
摘要 |
A liquid phase etching method which comprises spraying a chemically reactive liquid, with a specific speed, to a solid article, an aggregate of solid articles or a gelatinous material to be treated; and a liquid etching apparatus having a mechanism for holding a processing object to be treated and a nozzle structure for spraying a chemically reactive liquid to the processing object to be treated which is held by the mechanism. The method and apparatus allow the significant improvement of the etching rate while maintaining the accuracy of etching.
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申请公布号 |
US2008196834(A1) |
申请公布日期 |
2008.08.21 |
申请号 |
US20080109623 |
申请日期 |
2008.04.25 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MIZUNO BUNJI;SASAKI YUICHIRO;NAKAYAMA ICHIRO;KANADA HISATAKA |
分类号 |
H01L21/306;H01L21/00;H01L21/311;H01L21/3213 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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