发明名称 LIQUID PHASE ETCHING METHOD AND LIQUID PHASE ETCHING APPARATUS
摘要 A liquid phase etching method which comprises spraying a chemically reactive liquid, with a specific speed, to a solid article, an aggregate of solid articles or a gelatinous material to be treated; and a liquid etching apparatus having a mechanism for holding a processing object to be treated and a nozzle structure for spraying a chemically reactive liquid to the processing object to be treated which is held by the mechanism. The method and apparatus allow the significant improvement of the etching rate while maintaining the accuracy of etching.
申请公布号 US2008196834(A1) 申请公布日期 2008.08.21
申请号 US20080109623 申请日期 2008.04.25
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 MIZUNO BUNJI;SASAKI YUICHIRO;NAKAYAMA ICHIRO;KANADA HISATAKA
分类号 H01L21/306;H01L21/00;H01L21/311;H01L21/3213 主分类号 H01L21/306
代理机构 代理人
主权项
地址