| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the amount of use of a sealant for sealing power elements mounted on a power circuit board and a bonding wire connected to the power circuit board. <P>SOLUTION: A power module comprises a power circuit board 10, and a resin case 30 where the power circuit board 10 is arranged inside. In the resin case 30, a partition wall 34 is formed for isolating a region A including a portion where the power circuit board 10 is arranged from a region B including only a portion where no power circuit board 10 is arranged. In the region A surrounded by the partition wall 34, a sealant 40 which seals a bare chip of the power circuit board 10 or the like is packed. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
