| 摘要 |
<p>[PROBLEMS] To provide an insulating resin layer, which has a carrier material and is applicable to a thin multilayer printed circuit board, to be used for a multilayer printed circuit board having excellent rigidity. [MEANS FOR SOLVING PROBLEMS] An interlayer insulating film having a carrier material is provided with a carrier material composed of a metal foil or a resin film, and an interlayer insulating film arranged on one surface of the carrier material. The interlayer insulating film is composed of a base material impregnated with a resin, the thickness of the base material is 8µm or more but not more than 20µm, and the elongation rate of the interlayer insulating film in the planar direction of the interlayer insulating film measured by a TMA method is 0.05% or less when the resin is cured for one hour at 170°C with a pressure of 30kgf/cm<SUP>2</SUP>.</p> |
