| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by which a cost of the semiconductor device with a shield function for intercepting an electromagnetic wave can be reduced, in the method of manufacturing the semiconductor device equipped with electronic parts packaged in a wiring substrate, and sealing resin containing a silica filler for sealing the electronic parts. <P>SOLUTION: This invention relates to a method of manufacturing a semiconductor device 10 equipped with: a wiring substrate 11 with a ground terminal 38; a semiconductor chip 12 and passive parts 14, 15 which are the electronic parts packaged in the wiring substrate 11; and sealing resin 19 containing the silica filler for sealing the semiconductor chip 12 and the passive parts 14, 15, wherein the silica filler residing on a front surface of sealing resin 19 is dissolved by a hydrogen fluoride aqueous solution, and thereafter a shield layer 21 electrically connected with the ground terminal 38 is formed on the front surface of the sealing resin 19 by a plating method. <P>COPYRIGHT: (C)2008,JPO&INPIT |
