发明名称 |
Microchip Assembly Produced by Transfer Molding |
摘要 |
The invention relates to a microchip assembly and an associated general production process, wherein an originally unshaped first component ( 1 ) is forged against the surface of a transfer molding form by an injected molten second component ( 5 ). The first component ( 1 ) may particularly comprise electrical tracks ( 3 ) on a carrier layer, said carrier layer being removed after the solidification of the injected material. According to a preferred embodiment, a microchip ( 8 ) is bonded to the electrical tracks ( 3 ) and then embedded in a filling ( 10 ). The electrical tracks ( 3 ) preferably lead from the front side ( 11 ) of the microchip ( 8 ) to the back side of the assembly, where they can be connected to external circuits. A sensitive front side ( 11 ) of a sensor microchip ( 8 ) can thus be placed very close to the front plane of the whole assembly, making the assembly apt for biosensor applications.
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申请公布号 |
US2008197432(A1) |
申请公布日期 |
2008.08.21 |
申请号 |
US20060994441 |
申请日期 |
2006.06.28 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS, N.V. |
发明人 |
WEEKAMP JOHANNES WILHEMUS;ANSEMS WILL;DE BOER HEDZER |
分类号 |
H01L29/82;B29C45/14;H01L21/56;H01L29/00 |
主分类号 |
H01L29/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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