发明名称 |
Printed circuit board substrate and method for constructing same |
摘要 |
A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A first signal path layer is embedded in the first dielectric material and a second signal path layer is embedded in the second dielectric material, wherein the first and second signal path layers are substantially parallel to each other in a stack-up arrangement. An adhesive layer is interposed between the first dielectric material and the second dielectric material.
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申请公布号 |
US2008196933(A1) |
申请公布日期 |
2008.08.21 |
申请号 |
US20080148017 |
申请日期 |
2008.04.16 |
申请人 |
BOIS KARL JOSEPH;MICHALKA TIMOTHY L |
发明人 |
BOIS KARL JOSEPH;MICHALKA TIMOTHY L. |
分类号 |
H01R12/14;H05K1/02;H05K1/11;H05K3/00;H05K3/46 |
主分类号 |
H01R12/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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