发明名称 Hard coating for cutting tool, and cutting tool coated with hard coating
摘要 A hard coating for a cutting tool being highly resistant to both wear and seizure; and a cutting tool coated with the hard coating. This hard coating is a multilayer film including two or more of the following layered in alternation: first coating layers including AgaCu1-a; and second coating layers including a nitride, oxide, carbide, carbonitride, or boride containing at least one element selected from among group IVA, VA, and VIA elements, aluminum, and silicon. Since the atomic proportion for the first coating layers is between 0.2 and 0.4, inclusive, the layering pitch of the first and second coating layers is between 0.2 and 100 nm, inclusive, and the total thickness is between 0.2 and 10.0 μm, inclusive, the coefficient of friction and cutting resistance can be reduced by the inclusion of silver in the coating, and provide a hard coating that exhibits superb lubricity and resistance to seizure.
申请公布号 US9409238(B2) 申请公布日期 2016.08.09
申请号 US201214389879 申请日期 2012.04.09
申请人 OSG CORPORATION 发明人 Sakurai Masatoshi;Toihara Takaomi
分类号 B23B27/14;B23B51/00;C23C30/00;C23C14/34;C23C28/00 主分类号 B23B27/14
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A cutting tool hard film disposed as a coating on a surface of a cutting tool, the cutting tool hard film being a multilayer film comprising: a first film layer comprising AgaCu1-a, where a is within a range of 0.2 or more and 0.4 or less, and a second film layer comprising one selected from the group consisting of a nitride, an oxide, a carbide, a carbonitride, and a boride, containing at least one element selected from the group consisting of group IVa elements, group Va elements, group VIa elements, Al, and Si, wherein: the first film layer and the second film layer being laminated alternately in two or more layers, a lamination cycle of the first film layer and the second film layer being within a range of 0.2 nm or more and 100 nm or less, and a total film thickness being within a range of 0.2 μm or more and 10.0 μm or less.
地址 Toyokawa-shi JP