VISION SYSTEM OF SAWING AND PLACEMENT EQUIPMENT

摘要

Disclosed herein is a vision system for inspect a sawing defect of semiconductor packages in sawing & placement equipment for manufacturing the semiconductor packages. The present invention provides a vision system of sawing & placement equipment, in which the position of a vision unit is selectively shifted according to a supply rate of the packages in order to inspect the packages at the most effective position, thus increasing the overall package processing efficiency, i.e., the unit per hour (UPH), of the equipment.