| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein when a side surface of a cathode layer of a capacitor element is connected to a cathode side-surface terminal plate using a conductive adhesive, the conductive adhesive spreads wider than the width of a cathode terminal to seep out from coating of a coating resin because of the variations in the quantity of the conductive adhesive or variation of pressing force to the cathode terminal, in a chip-type solid electrolytic capacitor of a side electrode, which is insulated by the coating resin and is provided with an external connection terminal on a side surface side thereof. SOLUTION: To provide a chip-type solid electrolytic capacitor, wherein a dam-like resin material is provided to the periphery of four sides of the inner surface of the cathode side-surface terminal plate. COPYRIGHT: (C)2008,JPO&INPIT
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