ENCAPSULATION METHOD OF LIGHT EMITTING DIODE

摘要

The present invention relates to a encapsulation manufacturing method of a light-emitting diode (LED), which comprises the steps of dispensing the photosensitive epoxy; immersing the LED chip in the epoxy; injecting the current in the LED chip, thereby making the epoxy resins polymerized and forming an encapsulant with specific shape on the LED chip; and removing the unpolymerized epoxy from the LED lamp.