发明名称 SOLDERING TRAINING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a soldering training substrate capable of automatically determining whether soldering is successful. SOLUTION: The soldering training substrate for determining whether or not the manual soldering on a point to be soldered on a substrate body is successful. It has a CPU and a plurality of electronic components for training in the substrate body. The respective electronic components are connected with the CPU via the point to be soldered. In addition, software for determining whether the soldering is successful is written into the CPU, which determines whether or not normal soldering takes place on the point to be soldered. The determination result by the software is output from the CPU. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008186877(A) 申请公布日期 2008.08.14
申请号 JP20070017247 申请日期 2007.01.29
申请人 MM DENSHI:KK 发明人 WATANABE MASAMITSU
分类号 H05K3/34;B23K1/00;B23K3/02;B23K101/42;H05K3/00 主分类号 H05K3/34
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