发明名称 RESIN SEALING DEVICE
摘要 PROBLEM TO BE SOLVED: To certainly detect sealing abnormality especially caused by the leak (overflow) of a resin or the mixing with foreign matter at its early stages, and to minimize the trouble caused by the sealing abnormality. SOLUTION: This resin sealing device 100 is provided with an upper mold 102 and the lower mold 104 arranged facing the upper mold 102 and capable of approaching/separating from the upper mold 102, constituted so as to compress and seal a product 160 to be molded by a resin 150 in the cavity 140 formed on at least a part of the facing surface of at least one of upper and lower molds 102 and 104, and equipped with an encoder 122 capable of detecting the relative position of the upper and lower molds 102 and 104 when both molds approach each other, a load cell 128 capable of detecting the pressure changed by the approach of the upper and lower molds 102 and 104, a memory part 132 capable of storing normal position data and normal pressure data when sealing is normally performed being the detected position and pressure data, and an arithmetic part 130 for judging sealing abnormality on the basis of the comparison of the normal position data and the normal pressure data with the position data and pressure data detected in present sealing work. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008183827(A) 申请公布日期 2008.08.14
申请号 JP20070019941 申请日期 2007.01.30
申请人 SUMITOMO HEAVY IND LTD 发明人 ISHIZUKA HIROYUKI
分类号 B29C43/32;B29C43/18;B29C43/36;B29C43/58;B29L31/34;H01L21/56 主分类号 B29C43/32
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