| 摘要 |
A sealed thermal interface component minimizes or eliminates the exudation of fluids, such as silicone oils, while preserving the excellent thermal conductivity of silicon-based thermal pad materials and enhancing the conformability of the component. In preferred embodiments, a foam frame surrounds a plurality of thermal pad portions formed of conformable thermal management material that may exude fluid under elevated temperatures or over time. Film encapsulates the foam-framed thermal pad portions, forming a sealed and partially evacuated thermal interface component. In one embodiment of the invention, the thermal pads are formed of an elastomeric matrix material containing silicone, the foam frame is made of urethane, and the film is made of polyurethane.
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