发明名称 PHOTORESIST COMPOSITION
摘要 The present application relates to a composition comprising a) a polymer containing an acid labile group; b) a compound selected from (i), (ii) and mixtures thereof, where (i) is Ai Xi Bi and (ii) is Ai Xi 1; and c) a compound of formula Ai Xi2 where Ai, Bi, Xi, Xi1, and Xi2 are defined herein. The compositions are useful in the semiconductor industry.
申请公布号 WO2008096263(A2) 申请公布日期 2008.08.14
申请号 WO2008IB00317 申请日期 2008.02.06
申请人 AZ ELECTRONIC MATERIALS USA CORP. 发明人 PADMANABAN, MUNIRATHNA;CHAKRAPANI, SRINIVASAN
分类号 G03F7/004;G03F7/039 主分类号 G03F7/004
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