| 摘要 |
In an imaging device module according to the invention, an opening is provided in an FPC board accommodated in an apparatus chassis. An insulating sheet of an imaging device is mounted opposite the opening on the FPC board. In a configuration of the imaging device module, a heat reflection member is thermally coupled to the insulating sheet, and a first radiation member thermally coupled to both the apparatus chassis and the imaging device is disposed so as to face the heat reflection member.
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