METHOD FOR DESIGNING A LEADLESS CHIP CARRIER

摘要

A method for surface mounting a leadless chip carrier to a circuit board, the method includes the steps of providing the leadless chip carrier with chamfered edges along one or more sides and with package metallic connection portions disposed along one or more chamfered edges; providing the circuit board with a plurality of circuit board metallic connection portions; placing a layer of solder onto the circuit board metallic connection; placing the leadless chip carrier on the circuit board with the package metallic connections, layer of solder and the circuit board metallic connections aligned; and heating the leadless chip carrier and the circuit board so the layer of solder forms a solder joint with the package metallic connection portions and the circuit board metallic connections.