发明名称 THERMALLY-CONDUCTIVE AND ELECTRICALLY-CONDUCTIVE PASTE, SUBSTRATE FOR LIGHT-EMITTING DIODE USING THE SAME, AND METHOD OF MANUFACTURING SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate for a light-emitting diode whose reflection member for enhancing luminance of the light-emitting diode can be easily formed and in which a countermeasure for heat generation can be taken, a method of manufacturing the same, and a paste material used for the same. <P>SOLUTION: A thermally-conductive as well as electrically-conductive paste, in which a thermosetting resin, curing agent, and thermally-conductive filler are included, is printed on a substrate, and is cured on the substrate to form a protrusion that is to be a light reflection member. The light reflection member is formed by electroplating preferably Ag or Ni on the surface of the cured paste. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008187053(A) 申请公布日期 2008.08.14
申请号 JP20070020075 申请日期 2007.01.30
申请人 TATSUTA SYSTEM ELECTRONICS KK 发明人 IWAI YASUSHI
分类号 H01L33/60;H01L23/373;H01L33/62;H01L33/64 主分类号 H01L33/60
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