POLYIMIDE COPOLYMER, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a new precursor of a polyimide copolymer, to provide the polyimide copolymer having excellent solder heat resistance and bent plate folding endurance representing folding endurance and to simultaneously provide a positive type photosensitive resin composition having pattern-forming properties of high resolution and developable with an aqueous solution of an alkali.

SOLUTION: The positive type photosensitive resin composition comprises (A) the precursor of the polyimide copolymer having a specific repeating unit (hereinafter based on pts.wt.) and the following (B) to (D): (B) 2-5 pts.wt. of a photosensitizer generating an acid by irradiation of active rays, (C) 15-25 pts.wt. of a cross-linking agent represented by general formula (5) (not shown) and (D) 150-1,900 pts.wt. of an aprotic polar amide solvent represented by formula (2) (not shown).

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