| 摘要 |
PROBLEM TO BE SOLVED: To supply a resin in a uniform thickness to a resin destination. SOLUTION: A resin feeding mechanism, before a substrate loaded with semiconductor chips etc. , is supplied to a resin sealing apparatus for compression-sealing the substrate with the resin 300, supplies the resin 300 to a pre-molding apparatus for molding the resin in advance in a prescribed shape. The resin 300 is supplied to the resin destination through a chute 112 stretching vertically. A conical diffusion mechanism 114 is provided for diffusing the supplied resin 300 into the chute 112. COPYRIGHT: (C)2008,JPO&INPIT
|
