| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dressing method of a chemical mechanical polishing pad in which the in-plane uniformity of a polished surface and the long term stability of polishing speed are ensured while improving the lifetime of the polishing pad sharply. <P>SOLUTION: The dressing method of a chemical mechanical polishing pad includes a step of abrading a polishing surface at an abrasion speed of 0.2 μm/min or above with a dressing load of 2 lbf or above in the state where a cleaning composition containing at least either one of a component for making a water insoluble compound containing a metal atom and/or a metal ion water soluble, and a component for forming a water soluble complex with a metal atom and/or a metal ion, is brought into contact with the polishing surface of the chemical mechanical polishing pad. <P>COPYRIGHT: (C)2008,JPO&INPIT |
