发明名称 Semiconductor devices and fabrication methods thereof
摘要 Semiconductor devices and fabrication methods thereof. The semiconductor device includes a semiconductor substrate with a body region of a first doping type. A gate structure is patterned on the semiconductor substrate. A single spacer is formed on a first sidewall of the gate structure. A body region of a first doping type is formed in the semiconductor substrate adjacent to a second sidewall of the gate structure. A source region of a second doping type is formed on the body region and having an edge aligned with the second sidewall of the gate structure. A drain region of the second doping type is formed on the semiconductor substrate and having an edge aligned with an exterior surface of the single sidewall.
申请公布号 US2008191276(A1) 申请公布日期 2008.08.14
申请号 US20070703678 申请日期 2007.02.08
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHEN CHI-CHIH;LIN YI-CHUN;WU KUO-MING;LIU RUEY-HSIN
分类号 H01L29/76;H01L21/336 主分类号 H01L29/76
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