发明名称 Chemical Mechanical Polishing Slurries, Their Applications and Method of Use Thereof
摘要 This invention disclosed a chemical mechanical polishing slurry, which includes at least one abrasive particle, an oxidant and a carrier. The oxidant is combined with a big metallorganic compound; and the applications and corresponding handling method are also disclosed. This invention slurry can realize high removal rate, no corrosion, low defectivity and high plan
申请公布号 US2008190894(A1) 申请公布日期 2008.08.14
申请号 US20060918956 申请日期 2006.04.19
申请人 YU CHRIS CHANG;YANG ANDY CHUNXIAO;SHIAO DANNY ZHENGLONG 发明人 YU CHRIS CHANG;YANG ANDY CHUNXIAO;SHIAO DANNY ZHENGLONG
分类号 C23F1/00;C23F1/10 主分类号 C23F1/00
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