METHOD OF FLIP-CHIP PACKAGING OF LED USING THE ULTRASONIC WAVE

摘要

A flip-chip packaging method of an LED(light emitting diode) using an ultrasonic wave is provided to shorten an interval of process time by forming a plate bump or a stud bump on a wafer. A stud bump or a plate bump is formed on an LED wafer(S301). The wafer is divided into a plurality of LED chips(S302). The divided LED chip is directly mounted on a substrate(S303). An epoxy material is deposited and hardened in the periphery of the LED chip mounted on the substrate(S304). Phosphor is deposited on the LED chip(S305). A lens is molded by using epoxy(S306). In directly mounting the divided LED chip on the substrate, heat or pressure is applied to the substrate or the LED chip and ultrasonic wave is applied to bond a pad of the substrate to a bump formed on the LED chip by a flip-chip bonding process. The substrate can be made of silicon, ceramic or a polymer-based material.