| 摘要 |
A semiconductor device is provided to prevent an erroneous coupling between an antenna and an IC(Integrated Circuit) by forming the antenna in a desired shape. A semiconductor device includes an IC(102) and first and second antennas(103a,103b). The IC is formed on a first surface of an insulation substrate and includes TFTs(Thin Film Transistors). The first antenna is arranged on the IC. The second antenna is formed on a second surface of the insulation substrate. The first antenna is electrically connected to the IC. The second antenna is electrically connected to the IC through a through-hole, which is formed on the insulation substrate. The first and second antennas are overlapped with the IC.
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