| 摘要 |
An USB(Universal Serial Bus) memory package and a manufacturing method thereof are provided to reduce its thickness by forming a USB land instead of a USB plug to be coupled with a USB receptacle. A substrate(110) includes a plurality of wiring patterns(112a) formed on an upper surface thereof. One or more passive elements(120) are connected electrically to the wiring patterns of the substrate. One or more controllers(130) are connected electrically to the wiring patterns of the substrate. One or more flash memories(140) are connected electrically to the wiring patterns of the substrate. One or more signal control units(150) are connected electrically to the wiring patterns of the substrate. The passive elements, the controllers, the flash memories, and the signal control units are sealed with a sealing part(160). A USB land(113) is formed with the wiring patterns and a conductive via at a lower surface of one side of the substrate. A flat panel display(170) is connected electrically to the wiring patterns of the substrate to display images. |
