发明名称 Solder preform for low heat stress laser solder attachment
摘要 A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, the groove being larger in width than the diameter of the optical fiber to allow unimpeded alignment of the optical fiber. The solder preform above, wherein the body is formed substantially as a geometric shape, for example, a substantially rectangular box, a substantially cubical box, substantially a cylinder, substantially a semi-cylinder, substantially a sphere, substantially a semi-sphere, and substantially a cone or any geometric shape having a flat surface and a groove found therein.
申请公布号 US7410088(B2) 申请公布日期 2008.08.12
申请号 US20030656392 申请日期 2003.09.05
申请人 MATSUSHITA ELECTRIC INDUSTRIAL, CO., LTD. 发明人 HEMINWAY TREBOR;MASSEY BRIAN;POWERS MICHAEL;SOSSONG RUSSEL S.
分类号 B23K35/14;B23K1/005;B23K3/00;B23K35/02;B23K101/38;G02B6/42 主分类号 B23K35/14
代理机构 代理人
主权项
地址