| 摘要 |
<p>An anisotropic conductive film is provided to realize high insulation property in a narrow space, and improved connection reliability at a fine connection pitch, when used in connecting circuit boards with each other or an electronic part with a circuit board. An anisotropic conductive film is interposed between two circuit electrodes opposite to each other, accomplishes electric connection between the two opposite circuit electrodes by pressurizing the electrodes along the pressurizing direction, and has a bilayer structure. The anisotropic conductive film is obtained by the method comprising the steps of: laminating a first adhesive film layer comprising a photopolymerizable resin, a photoinitiator, a thermosetting resin, a curing agent for the thermosetting resin, and conductive particles, and a second adhesive film layer comprising a thermosetting resin and a curing agent for the thermosetting resin; and carrying out photopolymerization of the first adhesive film layer.</p> |
